Modular High Speed Camera

imaging detector is designed with emphasis on fast frame rate, which goes up to 1700 frames/s. The camera module contains a single Timepix chip that can be connected to a computer with USB3.0 interface. The sustainable high frame rate makes it optimal for X-ray imaging of dynamic processes, for spectral X-ray imaging or ion detection. Advanced data processing algorithms allow ion detection with spatial super-resolution of up to 200 nm.

can be used in a variety of applications, such as fast radiography (X-rays, neutrons, ions), spectroscopic imaging (each pixel records the energy spectrum), particle tracking or Time-of-flight imaging. The sensor type and thickness can be customized and sensors can be also adapted for neutron imaging by deposition of a converter layer (6LiF). The spatial resolution, in some applications (thermal neutrons), can reach units of microns or even submicrometric level (ions).
  • Sensor Material:

    Si or CdTe
  • Sensor Thickness:

    100 μm, 300 μm and 500 μm for Si; 1 mm for CdTe
  • Sensitive Area:

    14 mm x 14 mm
  • Number of Pixels:

    256 x 256
  • Pixel Pitch:

    55 μm
  • Resolution:

    9 lp/mm
  • Readout Speed:

    1700 frames/s
  • Photon Counting Speed:

    Up to 3 x 106 photons/s/pixel
  • Threshold Step Resolution:

    0.1 keV
  • Energy Resolution:

    0.8 keV (THL) and 2 keV (ToT)
  • Min Detectable Energy:

    5 keV for X-rays
  • Readout Chip:

  • Pixel Mode of Operation:

    Counting, Time-over-Threshold, Time-of -Arrival
  • Connectivity:

    USB 3.0
  • Weight:

    503 g
  • Dimensions:

    125 mm x 79 mm x 25.5 mm (L x W x H)
  • Software:

    Pixet PRO
  • AdvaPIX