Sensor Manufacturing and Micro Packaging
Wafer Solder Bumping
Flip Chip Bonding
Advacam is a one-stop shop for high quality turnkey silicon sensor manufacturing and micro-packaging services. Advacam is a commercial foundry providing challenging R&D and manufacturing services within hybrid pixel detectors for different scientific and industrial partners. The service portfolio comprises of a unique combination of front-end silicon sensor processing and back-end micro-packaging activities (i.e., wafer bumping and flip chip bonding). The process services are scalable from prototyping to production.
Advacam aims to be a globally distinguished production partner for hybrid pixel detectors. One of the basic operation principles is openness towards all the companies and believing on win-win scenarios by helping the customers to solve logistic and quality-based problems. Advacam wants to contribute to as many X-ray cameras using hybrid pixel detectors as possible.
Advacam's services are valued because of high quality and short delivery times Quality of the process services is Advacam’s core value. By mastering the sensor and micro-packaging processes and their relations, the quality-based problems can be more easily identified and eliminated.
Advacam is the leading company providing quick turnaround times of small series prototyping and production batches. The extensive experience in various projects helps us to shorten the delivery times; there’s no need to re-invent the wheel.
Advacam Oy is a technology spin-off company from VTT technical research centre of Finland, and the team has more than 30-year experience in the sensor manufacturing, micro-bumping on various types of wafers and flip chip bonding of hybrid pixel detectors in different geometries. The team is very experience in solder bump based flip chip process for silicon and compound semiconductor sensors (CdTe, CdZnTe and GaAs).
Advacam operates in world-class clean room facility in Micronova facility. The 2,600m2 clean room is the largest R&D facility for fabrication of silicon-based microstructures in Nordic countries. There’s a great variety of process tools for the front- end silicon wafer processing and a complete flip chip line. All the process services for the semiconductor materials are done within the Micronova facility located in Espoo, Finland.