A multi-chip high-resolution large-area spectral scanner, enabling accurate material identification and superior image contrast. Suitable for industrial applications such as Computer tomography. Hardware integration of TDI mode.
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A multi-chip high-resolution large-area spectral scanner, enabling accurate material identification and superior image contrast. Suitable for industrial applications such as Computer tomography. Hardware integration of TDI mode.
Sensor Material: | Si or CdTe |
Sensor Thickness: | 300 μm for Si; 1 mm for CdTe |
Sensitive Area: | 28(14) x 211,2 mm |
Number of Pixels: | 512(256) x 3840 |
Pixel Pitch: | 55 μm |
Resolution: | 9 lp/mm |
Readout Speed: | 50 (1x15 tiles) and 20 (2x15 tiles) frames/s |
Time-Delayed-Integration | Integration Yes, hardware based (for 1x5 tiles variant) |
Thresholds per pixel | 1 or 2 |
Threshold Step | 0.1 keV |
Energy Resolution: | 0.7-2 keV (Si) and 1.2-3.6 (CdTe) |
Min Detectable Energy: | 4 keV (Si) and 5 keV (CdTe) |
Readout Chip: | Medipix3 |
Pixel Mode of Operation: | Counting in Single Pixel Mode (SPM) or Charge Summing Mode (CSM) |
Counter depth: | 12 or 24 bits (configurable) |
Dimensions: | 213 mm x 60 mm x 40 mm (L x W x H) |
Weight: | 1800 g |
Connectivity: | Ethernet |
Software: | Pixet Pro |
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