ADVACAM's standard offering covers pixel, micro strip and diode sensors fabricated on 6” (150 mm) high resistivity silicon wafers having thickness from 200 µm to 1 mm. Even thinner sensors, down to few micro meter thickness, can be fabricated using a well established carrier wafer technology. In addition, ADVACAM offers Si planar sensor processing on 8" (200 mm) high resistivity wafers for large area sensor components.
ADVACAM has specialized in the fabrication of edgeless pixel and microstrip sensors. Edgeless sensors are qualified by having the entire sensor volume sensitive to radiation. The process technology provides inactive regions of less than one micro meter. The edgeless sensors are fabricated on 6” (150 mm) high resistivity silicon wafers with thickness of 50 µm to 675 µm.