Other services

Advacam helps the customer with the mask design work to obtain the desired properties for the silicon sensor components. The layouts are typically delivered to customer in gds-format.

Advacam performs tailored dicing services using conventional diamond blade dicing. Dicing of the sensor wafers is tricky as micro-cracks may introduce significant leakage currents. We care about the customer wafers and they can be safely diced at Advacam. Step cutting (dicing with two passes) can be used for optimal dicing quality.

Dicing can be done for chips and wafers and the dicing can be also applied for pixellation of Cd(Zn)Te sensors.

Advacam also offers rapid and reliable handle wafer removal process for edgeless and 3D sensor wafers.

Please contact us.

Download presentation of service offering of Advacam